Three-dimensionally connected silica spheres-resin composite and method for production thereof

ABSTRACT

A three-dimensional composite of silica spheres interconnected by resin is provided having a three-dimensional network structure including silica particles having the following structural and dynamic characteristics and a resin present in the internal pores of said network: 
     (a) three-dimensionally interconnected spherical silica particles having a diameter of 6 to 30 μm; 
     (b) on the surface of said spherical silica particles, a specific surface area of 300 to 400 m 2  /g and pores having a radius of 5 to 10 nm; 
     (c) a bond interconnecting two spherical silica particles having a cross-sectional area within the range of 1/2 to 1/4 of the maximum cross-sectional area of that particle which is smaller in maximum cross-sectional area; 
     (d) mutually communicating voids formed within said network structure representing a void content which is 40 to 60%, based on the whole network structure; 
     (e) a silica content is 60 to 80% by weight based on the whole network structure; 
     (f) the network structure substantially remaining intact when said network structure is heat-treated by maintaining said network structure in air both at a temperature of 600° C. for 5 hours and at a temperature of 800° C. for 3 hours; 
     (g) said network structure capable of being machined and having an elasticity modulus of 1.5 to 2.0 GPa at temperatures below the glass transition temperature and an elasticity modulus of 0.18 to 0.25 GPa at temperatures between the glass transition point and 300° C.

This is a division of application Ser. No. 08/498,519 filed Jul. 5, 1995now abandoned.

FIELD OF THE INVENTION

The present invention relates to a three dimensionally connected silicaspheres-resin composite.

BACKGROUND OF THE INVENTION

Generally, silica particles show high oil absorption and high levelfilling with said particles is difficult to attain. Accordingly, it isdifficult to produce high-fill silica-polymer composite materials andthe like. Even when high level filling with silica and the like ispossible, the materials obtained have unsatisfactory physicalproperties, as discussed below, and can hardly be submitted to practicaluse.

Thus, for example, in the case of silica-polymer composite materialsprepared by random closest filling with powdery or flaky quartz glasspowder, the maximum fill is 77% by weight. In the case of highsilica-filled composite materials having a three-dimensional structureas synthesized from compatible polymer blend systems in a phaseseparation system utilizing the sol-gel process, the maximum fill is 80%by weight.

Although composite materials prepared from resins or the like with aninorganic material such as silica or glass have an increased rigidity(elasticity) with an increase in fill percentage, they have a decreasedimpact resistance, among others, and are hard and fragile or brittle. Asa result, the high silica or like material-filled composite materialsmentioned above are thus poor in shock resistance and like properties.Epoxy resin-based composite materials high filled with an inorganicmaterial such as silica or glass, for instance, rapidly lose theirrigidity at temperatures above the glass transition point of the resin.They are thus poor in high temperature stability.

SUMMARY OF THE INVENTION

It is a primary object of the present invention to provide a threedimensionally connected silica spheres-resin composite, which, in spiteof its high silica content, shows no tendency toward sudden rigidityloss at temperatures above the glass transition temperature and has goodhigh temperature stability.

The present invention is based on the finding that when a low polymer ofan alkoxysilane is subjected to hydrolysis and polymerization in a mixedsolution containing the alkoxysilane low polymer and a water-solublepolymer in a mixed solvent composed of water and alcohol in the presenceof an acid catalyst, a new structure having unique physical propertiescan be obtained.

Thus, the present invention is concerned with the following threedimensionally connected silica spheres-resin composite and the followingmethod for production thereof.

1. A three dimensionally connected silica spheres-resin compositecomprising a three-dimensional network structure consisting of sphericalsilica particles having the following structural and dynamiccharacteristics and a resin present in the internal pores thereof.

(1) It comprises three-dimensionally interconnected spherical silicaparticles having a diameter of 6 to 30 μm;

(2) Said spherical silica particles have, on the surface thereof, poreshaving a radius of 5 to 10 nm and have a specific surface area of 300 to400 m² /g;

(3) The cross-sectional area of the bond interconnecting two sphericalsilica particles is within the range of 1/2 to 1/4 of the maximumcross-sectional area of that particle smaller in maximum cross-sectionalarea;

(4) The particle surface of said spherical silica particles is wholly orpartly covered with a water-soluble polymer;

(5) There are mutually communicating voids formed within said networkstructure and the void content is 40 to 60% on the whole networkstructure basis;

(6) The silica content is 60 to 80% by weight on the whole networkstructure basis;

(7) When said network structure is heat-treated by keeping in air bothat 600° C. for 5 hours and at 800° C. for 3 hours, the network structuresubstantially remains intact;

(8) Said network structure can undergo machining and has an elasticitymodulus of 1.5 to 2.0 GPa at temperatures below the glass transitiontemperature and an elasticity modulus of 0.18 to 0.25 GPa attemperatures between the glass transition point and 300° C.

2. A method of producing the composite described under 1, characterizedin that a three-dimensional network structure obtained by causing a lowmolecular weight polyalkoxysilane to undergo hydrolysis andpolymerization reactions in the presence of an acid catalyst in a mixedsolution of said low molecular weight polyalkoxysilane and awater-soluble polymer in a solvent mixture of water and alcohol isimpregnated with a resin-forming monomer and/or prepolymer and theimpregnated structure is subjected to curing conditions.

3. A method of producing the composite described under 1, characterizedin that a three-dimensional network structure obtained by causing a lowmolecular weight polyalkoxysilane to undergo hydrolysis andpolymerization reactions in the presence of an acid catalyst in a mixedsolution of said low molecular weight polyalkoxysilane and awater-soluble polymer in a solvent mixture of water and alcohol isimpregnated with a thermoplastic resin and the impregnated structure issubjected to curing conditions.

4. A three dimensionally connected silica spheres-resin compositecomprising a three-dimensional network structure consisting of sphericalsilica particles having the following structural and dynamiccharacteristics and a resin present in the internal pores thereof.

(1) It comprises three-dimensionally interconnected spherical silicaparticles having a diameter of 6 to 30 μm;

(2) Said spherical silica particles have, on the surface thereof, poreshaving a radius of 5 to 10 nm and have a specific surface area of 300 to400 m² /g;

(3) The cross-sectional area of the bond interconnecting two sphericalsilica particles is within the range of 1/2 to 1/4 of the maximumcross-sectional area of that particle smaller in maximum cross-sectionalarea;

(4) There are mutually communicating voids formed within said networkstructure and the void content is 40 to 60% on the whole networkstructure basis;

(5) The silica content is 60 to 80% by weight on the whole networkstructure basis;

(6) When said network structure is heat-treated by keeping in air bothat 600° C. for 5 hours and at 800° C. for 3 hours, the network structuresubstantially remains intact;

(7) Said network structure can undergo machining and has an elasticitymodulus of 1.5 to 2.0 GPa at temperatures below the glass transitionpoint and an elasticity modulus of 0.18 to 0.25 GPa at temperaturesbetween the glass transition point and 300° C.

5. A method of producing the composite described under 4, characterizedin that a three-dimensional network structure obtained by causing a lowmolecular weight polyalkoxysilane to undergo hydrolysis andpolymerization reactions in the presence of an acid catalyst in a mixedsolution of said low molecular weight polyalkoxysilane and awater-soluble polymer in a solvent mixture of water and alcohol, andthen decomposing said water-soluble polymer is impregnated with aresin-forming monomer and/or prepolymer and the impregnated structure issubjected to curing conditions.

6. A method of producing the composite described under 4, characterizedin that a three-dimensional network structure obtained by causing a lowmolecular weight polyalkoxysilane to undergo hydrolysis andpolymerization reactions in the presence of an acid catalyst in a mixedsolution of said low molecular weight polyalkoxysilane and awater-soluble polymer in a solvent mixture of water and alcohol, andthen decomposing said water-soluble polymer is impregnated with athermoplastic resin and the impregnated structure is subjected to curingconditions.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 is a photomicrograph, taken on a scanning electron micrograph(SEM), showing the particle structure of the three-dimensional networkstructure comprising spherical silica particles as obtained in Example1.

DETAILED DESCRIPTION OF THE INVENTION

In the following, the present invention is described in further detail.Unless otherwise indicated, the inventions described above in paragraphs1 through 6 are referred to as the first aspect through the sixth aspectof the invention in the order mentioned.

The first aspect of the invention is characterized in that a resin ispresent in the internal pores of a three-dimensional network structurehaving the following characteristics (1)-(8).

(1) It comprises three-dimensionally interconnected spherical silicaparticles having a diameter of 6 to 30 μm. The phrase"three-dimensionally interconnected" means that one spherical silicaparticle is bound to one or more other spherical silica particles. Thespherical silica particles mentioned above are substantiallynoncrystalline. The diameter is generally about 6 to 30 μm, preferably10 to 20 μm.

(2) Said spherical silica particles have, on the surface thereof, poreshaving a radius of 5 to 10 nm and have a specific surface area of 300 to400 m² /g. The pores existing on the spherical silica particle surfacegenerally have a radius of about 5 to 10 nm, preferably 7 to 8 nm, butthere may also be present a certain percentage of pores which have aradius outside the above range provided that the above specific surfacearea requirement is satisfied.

(3) The cross-sectional area of the bond interconnecting two sphericalsilica particles is within the range of 1/2 to 1/4 of the maximumcross-sectional area of that particle smaller in maximum cross-sectionalarea. This means that when one spherical silica particle and one of theplurality of spherical silica particles bound thereto are compared, thebond between the two has a cross-sectional area of 1/2 to 1/4 of themaximum cross-sectional area of the particle smaller in maximumcross-sectional area. Therefore, the bonds among spherical silicaparticles have the so-called "constricted in the middle" shape. Acertain percentage of bonds having a cross-sectional area outside theabove range may exist provided that the effects of the invention willnot be adversely affected thereby.

(4) The particle surface of said spherical silica particles is wholly orpartly covered with a water-soluble polymer. The water-soluble polymeris not limited to any particular species provided that it is soluble inwater and compatible with the alcohol used. As examples that have suchproperties, there may be mentioned, among others, polyacrylic acid,polyethylene glycol, polyvinyl alcohol, polyvinyl acetate, water-solubleproteins, and sodium polystyrenesulfonate. The spherical silica particlesurface is wholly or partly covered with such a water-soluble polymerand it is desirable that not less than 90% of said surface should becovered with such polymer.

(5) There are mutually communicating voids formed within said networkstructure and the void content is 40 to 60% on the whole networkstructure basis. In the present invention, the phrase "mutuallycommunicating voids" means that individual pores are not independent butthree-dimensionally interconnected with one another. The structure maycontain closed pores of cells unless they substantially lessen theeffects of the present invention. The above-mentioned void content isgenerally about 40 to 60% but preferably 45 to 55%.

(6) The silica content is 60 to 80% by weight on the whole networkstructure basis. Said content is generally about 60 to 80% by weight butpreferably 60 to 70% by weight.

(7) When said network structure is heat-treated by keeping in air bothat 600° C. for 5 hours and at 800° C. for 3 hours, the network structuresubstantially remains intact. The phrase "substantially remains intact"means that the heat-treated structure does not show such hardening(embrittlement) resulting in disintegration as shown later herein incomparative examples.

(8) Said network structure can undergo machining and has an elasticitymodulus of 1.5 to 2.0 GPa at temperatures below the glass transitionpoint and an elasticity modulus of 0.18 to 0.25 GPa at temperaturesbetween the glass transition point and 300° C. Said machining includes,among others, cutting and shaping.

The composite according to the first aspect of this invention comprisesa resin present within the internal pores of the above-describedstructure. The term "pores" as used in this specification mean bothindependent air cells and continuous (intercommunicating or penetrating)air cells. Furthermore, the composite of this invention includes both(1) said structure filled completely with said resin (completely filledcomposite) and (2) said structure not completely filled with said resin(incompletely filled composite). The incompletely filled compositeincludes but is not limited to the composite in which only the surfaceof the pores is covered with the resin, the composite in which thediameter of pores has been reduced by the presence of the resin, and thecomposite in which only some of the available pores have been filledwith the resin.

The resin mentioned above is not restricted in kind but any of the knownthermosetting resins and thermoplastic resins can be employed only ifthe internal pores of said structure may be impregnated therewith. Thethermosetting resin includes but is not limited to epoxy resin,polyimide resin, unsaturated polyester resin, silicone resin, andphenolic resin. The thermoplastic resin includes but is not limited topolyethylene, polypropylene, polystyrene, polyamide, poly(vinylchloride) and methacrylic polymer.

The second and third aspects of this invention are concerned with theproduction technology for the above-described composite.

In accordance with the second aspect of this invention, athree-dimensional network structure obtained by causing a low molecularweight polyalkoxysilane to undergo hydrolysis and polymerizationreactions in the presence of an acid catalyst in a mixed solution ofsaid low molecular weight polyalkoxysilane and a water-soluble polymerin a solvent mixture of water and alcohol is impregnated with aresin-forming monomer and/or prepolymer and the impregnated structure issubjected to curing conditions.

In accordance with the third aspect of this invention, athree-dimensional network structure obtained by causing a low molecularweight polyalkoxysilane to undergo hydrolysis and polymerization in thepresence of an acid catalyst in a mixed solution of said low molecularweight polyalkoxysilane and a water-soluble polymer in a solvent mixtureof water and alcohol is impregnated with a thermoplastic resin and theimpregnated structure is subjected to curing conditions.

In the second and third aspects of this invention, saidthree-dimensional network structure is produced in the first place asfollows. Thus, in a mixed solution of a low molecular weightpolyalkoxysilane and a water-soluble polymer in a solvent mixture ofwater and alcohol, the hydrolysis reaction and polymerization reactionof said low molecular weight polyalkoxysilane are carried out in thepresence of an acid catalyst to provide a three-dimensional networkstructure comprising spherical silica particles.

The mechanisms of formation of the above structure in the said method ofthe invention are as follows. Simultaneously with the abovepolymerization reaction, phase separation occurs in the metastableregion, whereby nucleation for silica particles begins. In the course ofthe growth of silica particles, the system goes into the unstable region(spinodal decomposition region), where the silica particle growth isaccompanied by interparticle bonding. As a result, a three-dimensionalnetwork structure comprising spherical silica particles is formed.

In this connection, Nakanishi and his colleagues report, in the Journalof Non-Crystalline Solids, 139 (1992) pp. 1-13, that they obtainedentangled silica structures by gelating a homogeneous solution composedof tetraethoxysilane monomer or tetramethoxysilane monomer, polyacrylicacid, water, methanol or ethanol, and nitric acid at 60° C. to therebycause phase separation into a silica phase and a polymer phase withinthe unstable region defined by the spinodal curve, and then washing awaythe polymer phase.

On the contrary, the structure formation according to the presentinvention is effected while controlling the change in solventconcentration so that the system shifts into the unstable region after acertain extent of spherical silica particle growth in the metastableregion where nucleation and growth occur. The method of the presentinvention is essentially different from the method mentioned above whichstarts with an alkoxysilane monomer.

The monomer which serves the alkoxysilane low molecular weight polymeris not limited to any particular species but includes, among others,monomers having an alkoxy group containing 1 to 4 carbon atoms, such astetramethoxysilane and tetraethoxysilane. Suited for use as said lowmolecular weight polymer are those resulting from polymerization ofgenerally about 4 to 10 molecules of such a monomer. The low molecularweight polymer may be any per se known one or a commercially availableone.

The water-soluble polymer is not limited to any particular speciesprovided that it is compatible with the alcohol to be used. As examples,there may be mentioned polyacrylic acid, polyethylene glycol, polyvinylalcohol, polyvinyl acetate, water-soluble proteins, and sodiumpolystyrenesulfonate, etc. These may be used either alone or incombination. The water-soluble polymer may be used in the form of anaqueous solution prepared prior to mixing.

As a result of the presence of the water-soluble polymer in the reactionsystem according to the method of the present invention, the reactionsproceed according to the following mechanisms. Thus, as thepolymerization reaction of the alkoxysilane low polymer proceeds in thecompatible system comprising the alkoxysilane low polymer andwater-soluble polymer, the compatibility between the polymerizationproduct and water-soluble polymer decreases and said system enters thetwo-phase region (phase separation region), whereupon the samecomponents begin to gather respectively and phase separation starts. Inthis process, an entangled structure (three-dimensional interpenetratingstructure) is formed. Therefore, it is possible, by immobilizing thesystem at this stage by gel formation, to obtain a desiredthree-dimensional network structure. The three-dimensional networkstructure varies depending on the stage of phase separation at whichsaid gel formation occurs. Therefore, the physical properties (molecularweight, viscosity, etc.) of the water-soluble polymer and the amountthereof have great influences on the properties of the three-dimensionalnetwork structure formed in accordance with the present invention.

When the water-soluble solvent is absent in the reaction system or thecontent thereof is too small, disintegrated silica fragments alone areformed, failing to form the desired three-dimensional network structure.On the other hand, when the water-soluble polymer content is excessive,a mass composed of a swollen body of the water-soluble polymer and finesilica particles dispersed therein is formed.

As regards the proportions of said low polymer and water-solublepolymer, it is recommendable to use generally about 10 to 40 parts byweight, preferably 25 to 35 parts by weight, of the water-solublepolymer per 100 parts by weight of the alkoxy-silane low polymer. Whenthe proportion of the water-soluble polymer is too small, anythree-dimensional network structure comprising mutually interconnectedspherical silica particles will not be formed. In that case, moreparticularly, a state is attained in which the water-soluble polymer isfound dispersed in spherical form in silica glass. Upon drying, theglass is disintegrated into small pieces, giving granules about 1 to 2mm in size. On the other hand, when the water-soluble polymer is used inan excessively large proportion, a state results in which silicaparticles are dispersed in the water-soluble polymer, hence any desiredstructure can not be obtained.

The alcohol to be used in the water-alcohol mixed solvent is not limitedto any particular species provided that it can serve as the solvent.Thus, for example, lower alcohols containing 1 to 4 carbon atoms, suchas methyl alcohol, ethyl alcohol, propyl alcohol, isopropyl alcohol andbutyl alcohol, can suitable be used.

The proportions of water and the alcohol are generally 40 to 60% byweight of water and 60 to 40% by weight of alcohol, preferably 53 to 57%by weight of water and 47 to 43% by weight of alcohol. When thewater-soluble polymer is used in the form of an aqueous solution, theamount of water in said aqueous solution should be included incalculating the proportion of water in said mixed solvent.

The concentration of the solids comprising the alkoxysilane low polymerand the water-soluble polymer in said mixed solvent is generally about40 to 60% by weight but preferably 42 to 46% by weight.

As the acid catalyst, there may be mentioned inorganic acids such ashydrochloric acid, nitric acid and sulfuric acid as well as organicacids such as acetic acid, oxalic acid and formic acid. Among these,hydrochloric acid, nitric acid and acetic acid are preferred. The acidcatalyst is used generally in an amount of about 0.5 to 2% by weight,preferably 1 to 1.2% by weight, based on the whole reaction systemcomponents.

The order of mixing of these alkoxysilane low polymer, water-solublepolymer, water-alcohol mixed solvent and catalyst is arbitrary providedthat uniform mixing of these can be assured. Thus, for example, thesemay be mixed up all at once, or the alcohol may be added to thealkoxysilane low polymer, followed by admixing with an aqueous solutionof the water-soluble polymer and further by addition of the acidcatalyst. The water-alcohol mixed solvent may be prepared in situ byadding water and the alcohol separately.

The structure of the present invention can be produced by mixing thesecomponents uniformly, with stirring as necessary, and then allowing themixture to stand for maturation or aging. The aging temperature isgenerally about 20 to 25° C. The aging period is generally about 10 to35 days but may be shorter or longer depending on the starting materialspecies, aging temperature and other conditions.

The elastic modulus at ordinary and high temperatures as well as hightemperature stability of an example of the three-dimensional networkstructure according to this invention and an example of the cured epoxyresin (bisphenol F epoxy resin cured with himic anhydride) is providedbelow.

    ______________________________________                                                     This Invention                                                                          Epoxy resin                                            ______________________________________                                        Elastic modulus at                                                                            1.5 GPa     3.0 GPa                                           ordinary temperature                                                          Elastic modulus at                                                                           0.18 GPa    0.019 GPa                                          high temperature                                                              (≧ glass transition                                                    temperature)                                                                  High temperature stability                                                                   Stable at 300° C.                                                                  Destroyed at 250° C.                        ______________________________________                                    

Furthermore, the above structure can be further improved in strength bysubjecting it to a heat treatment at about 600-900° C. which results ina further progression of vitrification and a higher density (thermalshrinkage).

The internal pores of the three-dimensional network structure thusobtained are filled with a resin. This filling can be achieved either byimpregnating the structure with a resin-forming monomer and/orprepolymer and subjecting the impregnated structure to curing conditions(the second aspect of the invention) or impregnating the structure witha thermoplastic resin and subjecting the impregnated structure to curingconditions (the third aspect of the invention).

In the second aspect of the invention, said structure is immersed in animpregnating resin composition comprising a monomer and/or prepolymercapable of yielding a cured resin, where necessary supplemented with acuring agent, and after degassing if necessary, is caused to cure by,for example, heating. The monomer and/or prepolymer mentioned above isnot critical in kind but is preferably a substance that is liquid atatmospheric temperature, thus including those monomers and/orprepolymers which are generally used for the production of epoxy resin,polyimide resin, unsaturated polyester resin, silicone resin, phenolicresin and so on. As such monomers for thermoplastic resins, methylmethacrylate, vinyl acetate, dichlorophenylsulfonic acid, styrene, etc.can be mentioned.

In the third aspect of the invention, said structure is immersed in animpregnating resin composition comprising a thermoplastic resin, such asa polyethylene, polypropylene, polyamide, poly(vinyl chloride), ormethacrylic resin, either reduced in viscosity or melted by heating, andthen cooled to cure. The thermoplastic resin mentioned above is notcritical in kind but is preferably a resin of low melt index.

In the second and third aspects of the invention, said completely filledcomposite can be obtained by allowing the impregnating resin to curewhile the structure remains immersed therein.

On other hand, when the structure is taken out from the impregnatingresin composition and, then, allowed or caused to cure, saidincompletely filled composite is obtained. Thus, when the structure isimmersed in the impregnating resin composition, some of the resin findsits way into the surface pores (5-10 nm in diameter) of silica particlesand gets adhered to or adsorbed on the surfaces of the open pores of thestructure but the remaining resin finds its way out of the structurebefore curing with the result that at least part of the open porosityremains unfilled after curing to give said incompletely filledcomposite. Compared with the completely filled composite, theincompletely filled composite has a high silica (inorganic)/resin(organic) ratio and is a material comparatively light in weight andhaving a greater specific strength and a higher heat resistance. Theresin impregnation rate of such an incompletely filled composite can befreely controlled according to the kind of impregnating resin, physicalproperties of said structure, and other factors.

The fourth aspect of the invention utilizes a three-dimensional networkstructure in which its constituent spherical silica particles are notcovered with a water-soluble polymer. Specifically, whereas thespherical silica particles constituting the three-dimensional networkstructure are covered with a water-soluble polymer, this structure isheat-treated at a temperature not below the decomposition temperature ofsaid water-soluble polymer either as it is or after washing with waterif necessary to completely remove the water-soluble polymer. Theheat-treating temperature depends on the decomposition temperature(kind) of the water-soluble polymer but is generally not less than about500° C. The composite according to the fourth aspect of the invention isfundamentally identical with the first aspect of the invention exceptthat the water-soluble polymer is not present.

The fifth and sixth aspects of the invention are concerned with theproduction technology for the composite according to the fourth aspectof the invention and are identical with the second and third aspects ofthe invention except that the structure available upon removal of thewater-soluble polymer from the third-dimensional network structureaccording to the first aspect of the invention is employed.

In accordance with the present invention, the following meritoriousresults can be obtained. Thus, by the production methods according tothe second and third aspects of the invention, a three dimentionallyconnected silica spheres-resin composite having a novel construction andcharacteristic physical properties (the first aspect of the invention)can be provided. According to the fifth and sixth aspects of theinvention, a three dimensionally connected silica spheres-resincomposite having another novel construction and characteristic physicalproperties (the fourth aspect of the invention) can be obtained.

Since each of the composites of the present invention (the first andfourth aspects of the invention) is an interlocked assemblage of saidthree-dimensional network structure with said resin, its strength issubstantially retained even at high temperatures where the organicmatter undergoes pyrolysis or burn-out.

Moreover, unlike the conventional inorganic particle-packed composite,the above composite shows no appreciable loss of elastic modulus at theglass transition point of the resin and has a unique characteristic thatit rather shows an increase in the modulus of elasticity in the hightemperature region.

Furthermore, because its silica particle skeletal phase is apredominantly open cell structure, the above composite shows goodflexibility in the temperature region where the resin is not decomposed,in spite of its high inorganic packing or fill rate.

EXAMPLES

The following examples and comparative examples illustrate thecharacteristic features of the present invention.

Example 1

(a) Production of the three-dimensional network structure

A tetramethoxysilane low polymer (trademark "MS 51"; product ofMitsubishi Chemical; polymerization degree n=4; 14 parts) was blended,at 25° C., with 10 parts of special grade ethyl alcohol and 16 parts ofa 25% aqueous solution of polyacrylic acid (viscosity at 30° C.:8000-12000 cps), then 0.5 part of 36% hydrochloric acid was added, andthe mixture was stirred for 10 minutes and then allowed to stand at 25°C. for allowing the hydrolysis and polymerization reactions to proceed.After about 2 weeks of standing, the reaction mixture solidified to givea block-like matter.

The thus-obtained three-dimensional network structure comprisingspherical silica particles had the following physical properties.

(1) It comprises three-dimensionally interconnected spherical silicaparticles having a diameter of 6 to 8 μm;

(2) Said spherical silica particles have, on the surface thereof, poreshaving a radius of 5 to 7 nm and have a specific surface area of 320 to350 m² /g;

(3) The cross-sectional area of the bond interconnecting two sphericalsilica particles is within the range of 1/3 to 1/4 of the maximumcross-sectional area of that particle smaller in maximum cross-sectionalarea;

(4) The particle surface of said spherical silica particles is about 98%covered with polyacrylic acid;

(5) There are mutually communicating voids formed within said networkstructure and the void content is about 44% on the whole networkstructure basis;

(6) The silica content is 65% by weight on the whole network structurebasis;

(7) When said network structure is heat-treated by keeping in air bothat 600° C. for 5 hours and at 800° C. for 3 hours, the network structuresubstantially remains intact;

(8) Said network structure can undergo machining such as shaping and hasan elasticity modulus of 1.75 GPa at ordinary temperature (25° C.) andan elasticity modulus of 0.18 to 0.25 GPa at temperatures between theglass transition point and 300° C.

This structure was examined under a scanning electron microscope. Theresult is illustrated in FIG. 1.

(b) Production of a composite consisting of a silica particle skeletonand a resin

The above three-dimensional network structure was immersed in a mixtureof 50 parts of epoxy resin (Epikote 807™ Shell Petrochemical) and 54parts of the curing agent methylhimic anhydride supplemented with 1 mlof a cure accelerator tertiary amine and after 3 hours of degassing at50° C. (until the evolution of gas ceased), the curing reaction wascarried out at 100° C. for 2 hours and at 200° C. for 2 hours. Thesystem was then allowed to cool gragually to provide a pale yellowsilica-epoxy resin composite.

The dynamic elastic modulus values and breakdown temperature of thecomposite obtained are shown in the following table. For comparison, thedata on the known epoxy composite loaded with microfine silica particles(average particle diameter 1 μm) (silica powder:epoxy resin=53:47) arealso shown.

    ______________________________________                                                      This Invention                                                                           Epoxy composite                                      ______________________________________                                        Elastic modulus (25° C.)                                                               4.42 GPa      6.51 GPa                                        Elastic modulus (250° C.)                                                              0.17 GPa     0.036 GPa                                        Elastic modulus (370° C.)                                                              0.40 GPa     --                                               Breakdown temperature                                                                         ≧400° C.                                                                     280° C.                                   ______________________________________                                    

It can be seen from the above data that despite its satisfactory elasticmodulus around atmospheric temperature, the conventional epoxy resincomposite undergoes a sharp decrease in the modulus at 250° C. and evencollapsed at 280° C.

In contrast, the composite of this invention has the uniquecharacteristic that its elastic modulus decreases at the glasstransition temperature (121° C. (dynamic elastic modulus measured at 3.5Hz)), retains this level up to about 250° C., then shows a steadyincrease in elastic modulus with increasing temperature, exhibits amaximum modulus at 370° C., and retains this value up to 400° C.

Example 2

The same three-dimensional network structure as that used in Example 1was immersed in a mixture of 150 parts of epoxy resin (Epikote 807™,Shell Petrochemical) and 162 parts of the curing agent methylhimicanhydride supplemented with 1 ml of dimethylbenzylamine and after 3hours of degassing at 60° C. for sufficient penetration of the epoxyresin into the silica particle pores. The three-dimensional networkstructure was taken out from the mixture and the curing reaction wascarried out at 100° C. for 2 hours and, then, at 200° C. for 2 hours.The structure was then allowed to cool gradually to provide a pale brownsilica-epoxy composite.

In this composite, the surface of open cells of the skeletal silicaparticle three-dimensional structure had been covered with the epoxyresin and the size of open cells had been decreased by the thickness ofthe epoxy resin layer.

Example 3

A mixture of 100 parts of novolac epoxy resin (Epikote 152™, ShellPetrochemical) and 34 parts of the curing agent diphenylaminosulfone washeated at 60° C. and the same three-dimensional network structure asthat described in Example 1 was immersed. After about 2 hours ofdegassing at 60° C., when gas evolution had ceased, the structure waswithdrawn from the mixture and the curing reaction was conducted at 175°C. for 18 hours to provide a dark brown composite having epoxyresin-clad open cells.

Example 4

The same three-dimensional network structure as that described inExample 1 was heat-treated for thermal shrinkage at 800° C. for 3 hours.Then, as in Example 1, it was immersed in an epoxy resin-methylhimicanhydride mixture, subjected to degassing at 50° C. for about 1 hour(until the evolution of gas ceased), cured at 100° C. for 2 hours and at200° C. for 2 hours, and allowed to cool gradually to provide a paleyellow silica-epoxy resin composite.

Since this composite was hard and high in rigidity, it was found thatthe properties of the thermally shrunken silica three-dimensionalnetwork structure were dominant. SEM observation showed that thisproduct was a solid composite comprising a three-dimensional networkstructure completely filled with epoxy resin.

Example 5

The same three-dimensional network structure as that described inExample 1 was heat-treated at 600° C. for 5 hours. This heat-treatmentcaused about 10% shrinkage of the structure one-dimensionally but thethree-dimensional structure was still retained. This heat-treatedthree-dimensional structure was immersed in an epoxy resin-methylhimicanhydride mixture as in Example 1. After about 2 hours of degassing at50° C., the structure was withdrawn from the mixture and cured toprovide a pale yellow three-dimensional silica-epoxy resin composite inwhich the surfaces of the interconnected silica particles have beencovered with the epoxy resin. SEM examination revealed that thiscomposite still had some residual open porosity.

Example 6

The same three-dimensional network structure as that described inExample 1 was immersed in a molten polyamide (nylon 6) at 230° C. in avessel equipped with degassing means and the evolved gas was removed forabout 30 minutes as the structure was allowed to cool. The structure wasthen cooled under atmospheric pressure to provide a whitish pale yellowcompletely filled silica-polyamide composite.

What is claimed is:
 1. A three-dimensional composite of silica spheresinterconnected by resin comprising a three-dimensional network structurecomprising silica particles having the following structural and dynamiccharacteristics and a resin present in the internal pores of saidnetwork;(a) three-dimensionally interconnected spherical silicaparticles having a diameter of 6 to 30 μm; (b) on the surface of saidspherical silica particles, a specific surface area of 300 to 400 m² /gand pores having a radius of 5 to 10 nm; (c) a bond interconnecting twospherical silica particles having a cross-sectional area within therange of 1/2 to 1/4 of the maximum cross-sectional area of that particlewhich is smaller in maximum cross-sectional area; (d) said sphericalsilica particles having a particle surface which is wholly or partlycovered with a water-soluble polymer; (e) mutually communicating voidsformed within said network structure representing a void content whichis 40 to 60%, based on the whole network structure; (f) a silica contentis 60 to 80% by weight based on the whole network structure; (g) thenetwork structure substantially remaining intact when said networkstructure is heat-treated by maintaining said network structure in airboth at a temperature of 600° C. for 5 hours and at a temperature of800° C. for 3 hours; (h) said network structure capable of beingmachined and having an elasticity modulus of 1.5 to 2.0 GPa attemperatures below the glass transition temperature and an elasticitymodulus of 0.18 to 0.25 GPa at temperatures between the glass transitionpoint and 300° C.
 2. The composite of claim 1 wherein said resin is athermosetting resin or a thermoplastic resin.
 3. The composite of claim2 wherein said thermosetting resin is an epoxy resin, polyimide resin,unsaturated polyester resin, silicone resin or phenolic resin.
 4. Thecomposite of claim 2 wherein said thermoplastic resin is a polyethylene,poly(vinyl chloride), polypropylene, polystyrene, polyamide, poly(vinylacetate) or methacrylic resin.
 5. A three-dimensional composite ofsilica spheres interconnected by resin comprising a three-dimensionalnetwork structure comprising silica particles having the followingstructural and dynamic characteristics and a resin present in theinternal pores of said network;(a) three-dimensionally interconnectedspherical silica particles having a diameter of 6 to 30 μm; (b) on thesurface of said spherical silica particles, a specific surface area of300 to 400 m² /g and pores having a radius of 5 to 10 nm; (c) a bondinterconnecting two spherical silica particles having a cross-sectionalarea within the range of 1/2 to 1/4 of the maximum cross-sectional areaof that particle which is smaller in maximum cross-sectional area; (d)mutually communicating voids formed within said network structurerepresenting a void content which is 40 to 60%, based on the wholenetwork structure; (e) silica content is 60 to 80% by weight based onthe whole network structure; (f) the network structure substantiallyremaining intact when said network structure is heat-treated bymaintaining said network structure in air both at a temperature of 600°C. for 5 hours and at a temperature of 800° C. for 3 hours; (g) saidnetwork structure capable of being machined and having an elasticitymodulus of 1.5 to 2.0 GPa at temperatures below the glass transitiontemperature and an elasticity modulus of 0.18 to 0.25 GPa attemperatures between the glass transition point and 300° C.
 6. Thecomposite of claim 5 wherein said resin is a thermosetting resin or athermoplastic resin.
 7. The composite of claim 6 wherein saidthermosetting resin is an epoxy resin, polyimide resin, unsaturatedpolyester resin, silicone resin or phenolic resin.
 8. The composite ofclaim 6 wherein said thermoplastic resin is a polyethylene, poly(vinylchloride), polypropylene, polystyrene, polyamide, poly(vinyl acetate) ormethacrylic resin.